GRANTED PATENTS

37.       S.K. Patil, S. Singh, U. Okoroanyanwu, O. Wood, P. Mangat, “Mask structures and methods of manufacturing,” U.S. Patent 9,195,132 (2015).

36.       T. Wallow, U. Okoroanyanwu, “Method for forming a photoresist pattern on a semiconductor wafer using oxidation-based catalysis,” U.S. Patent 8,852,854 (2014)

35.       B.M. LaFontaine, Y.-H. Kim, H.J. Levinson, U. Okoroanyanwu, “Optical polarizer with nanotube array,” U.S. Patent8,792,161 (2014)

34.       U. Okoroanyanwu, T. Wallow, “Method for producing a high resolution resist pattern on a semiconductor wafer” U.S. Patent 8,715,912 (2014)

33.       U. Okoroanyanwu, H.J. Levinson, R.-H Kim, T. Wallow, “Method for forming a high resolution resist pattern on a semiconductor wafer” U.S. Patent 8,586,269 (2013)

32.       H.J. Levinson, U. Okoroanyanwu, A. Tchikoulaeva, R. Wirtz, “Fluorine-passivated reticles for use in lithography and method for fabricating the same” U.S. Patent 8,338,061 (2012)

31.       M. Buynoski, U. Okoroanyanwu, S.K.  Pangrle, N.H. Tripsas, “Semiconductor device built on plastic substrate” US Patent8,044,387 (2011)

30.       S.K.  Pangrle, M. Buynoski, N.H. Tripsas, U. Okoroanyanwu, “Processing a copolymer to form a memory cell” US Patent8,012,673 (2011)

29.       N.H. Tripsas, U. Okoroanyanwu, S.K.  Pangrle, M.A. VanBuskirk, “Stacked organic memory devices and methods of operating and fabricating” US Patent 8,003,436 (2011)

28.       H.J. Levinson, U. Okoroanyanwu, A. Tchikoulaeva, R. Wirtz, “Fluorine-passivated reticles for use in lithography and method for fabricating the same” U.S. Patent No7,985,513 (2011)

27.       U. Okoroanyanwu, R.-H. Kim, “EUV pellicle and method for fabricating semiconductor dies using same,” U.S. Patent7,767,985 (2010)

26.       N.H. Tripsas, U. Okoroanyanwu, S.K.  Pangrle, M.A. VanBuskirk, “Stacked organic memory devices and methods of operating and fabricating” US Patent 7,465,956 (2008)

25.       R. Subramanian, S. Bell, T. Lukanc; Todd, M. Plat, U. Okoroanyanwu, H.E. Kim; Hung-Eli, “Two mask photoresist exposure pattern for dense and isolated regions” US Patent 7,368,225 (2008)

24.       U. Okoroanyanwu, “Method for patterning electrically conducting poly(phenyl acetylene) and poly(diphenyl acetylene),” U.S. Patent 7,344,912 (2008)

23.       U. Okoroanyanwu, N.F. Yudanov “Dielectric pattern formation for organic electronic devices” US Patent 7,012,013 (2006)

22.       N.H. Tripsas, U. Okoroanyanwu, S.K.  Pangrle; Suzette M.A. VanBuskirk, “Stacked organic memory devices and methods of operating and fabricating” US Patent 6,979,837 (2005)

21.       N. Tripsas, M. Buynoski, U. Okoroanyanwu, S.K. Pangrle, “Planar Polymer Memory Device” US Patent 6,977,389 (2005)

20.       U. Okoroanyanwu, S. Lopatin, M. Buynoski, “CuS formation by anodic sulfide passivation of copper surface” US Patent6,893,895 (2005)

19.       U. Okoroanyanwu, A. Acheta “Materials and methods for sublithographic patterning of gate structures in integrated circuit devices” US Patent 6,884,735 (2005)

18.       N. Tripsas, U. Okoroanyanwu, S.K. Pangrle, M.A. Van Buskirk “Stacked organic memory devices and methods of operating and fabricating” US Patent 6,870,183 (2005) 

17.       M. Buynoski, S.K. Pangrle, U. Okoroanyanwu, N. Tripsas “Self-assembly of conducting polymer for formation of polymer memory cell” US Patent 6,852,586 (2005).

16.       C.T. Gabriel, U. Okoroanyanwu, “Process for improving the etch stability of ultra-thin photoresist” US Patent 6,815,359(2004)

15.       R. Subramanian, S. Bell, T. Lukanc; Todd, M. Plat, U. Okoroanyanwu, H.E. Kim, “Two mask photoresist exposure pattern for dense and isolated regions” US Patent 6,803,178 (2004)

14.       N.H. Tripsas, M.S. Buynoski, S.K. Pangrle, U. Okoroanyanwu, A. Hui, C.F. Lyons, R. Subramanian, S.D. Lopatin, M.V. Ngo, A.M. Khathuria, M.S. Chang, P.K. Cheung, J.V. Oglesby, “Polymer memory device formed in via opening” US Patent6,787,458 (2004)

13.       U. Okoroanyanwu, B. Singh, A. Acheta “SEM inspection and analysis of patterned photoresist features” US Patent 6,774,365 (2004)  

12.       U. Okoroanyanwu, “Materials and methods for sub-lithographic patterning of contact, via, and trench structures in integrated circuit devices” US Patent 6,767,693 (2004)  

11.       U. Okoroanyanwu, A. Bottelli, “Self-aligned pattern formation using wavelengths” US Patent 6,764,808 (2004)  

10.       U. Okoroanyanwu, S.K. Pangrle, M. Buynoski, N.H. Tripsas, M.S. Chang, R. Subramanian, A.T. Hui, “Method(s) facilitating formation of memory cell(s) and patterned conductive” US Patent 6,753,247 (2004)  

9.         C. Gabriel, H.J. Levinson, U. Okoroanyanwu, “Selective photoresist hardening to facilitate lateral trimming” US Patent 6,716,571 (2004)  

8.         U. Okoroanyanwu, C.-Y. Yang, J.A. Shields, “Process for reducing the critical dimensions of integrated circuit device features” US Patent 6,653,231 (2003)  

7.         J.A. Shields, U. Okoroanyanwu, C.-Y. Yang, “Process for forming sub-lithographic photoresist features by modification of the photoresist surface” US Patent 6,630,288 (2003)  

6.         U. Okoroanyanwu, “Process for reducing the pitch of contact holes, vias, and trench structures in integrated circuits” US Patent 6,589,713 (2003)

5.         U. Okoroanyanwu, J. Shields, C.Y. Yang, “Process for preventing deformation of patterned photoresist features” US. Patent 6,589,709 (2003)

4.         U. Okoroanyanwu, “Process for reducing critical dimensions of contact holes, vias, and trench structures in integrated circuits” US Patent 6,518,175 (2003)

3.         U. Okoroanyanwu, R. Subramanian, “Interconnect structure with silicon containing alicyclic polymers and low-k dielectric materials and method of making same with single and dual damascene techniques” US Patent 6,475,904 (2002)

2.         R. Subramanian, C. Lyons, U. Okoroanyanwu, “Interconnect structure with low dielectric materials and method of making the same with single and dual damascene techniques” US Patent 6,127,089 (2000)

1.         C.G. Willson, U. Okoroanyanwu, D. Medeiros, “Photoresist compositions comprising norbornene derivative polymers with acid labile groups” US Patent 6,103,445 (2000)


BOOKS

3.         U. OkoroanyanwuChemistry and Lithography, 2nd ed.,  Vol. 1: Chemical History of Lithography, SPIE Press, Bellingham, 252 pages (2020)

2.         U. OkoroanyanwuMolecular Theory of Lithography, SPIE Press, Bellingham, 488 pages (2015).

1.         U. OkoroanyanwuChemistry and Lithography, SPIE Press, Bellingham; John-Wiley & Sons, Inc., Hoboken, N.J., 892 pages (2010).


BOOK CHAPTER

1.        U. Okoroanyanwu, J.D. Byers, T. Cao, S.E. Webber, C.G. Willson,  “Deprotection kinetics of alicyclic polymer resist systems designed for ArF (193 nm) lithography” in Polymers for Micro- and Nano-Patterning Science and Technology (H. Itoh, E. Reichmanis, O. Nalamasu, T. Ueno, eds.) ACS Books, American Chemical Society: Washington, DC, Ch. 14, pp. 174-190 (1998).


PEER-REVIEWED SCIENTIFIC AND TECHNICAL JOURNAL ARTICLES

22.       U. Okoroanyanwu, A. Bhardwaj, V. Einck, A. Ribbe, J. Morere, W. Schmidt, J.J. Watkins, “Facile synthesis of silicon containing ceramics via rapid photothermal pyrolysis of organosilicon preceramic polymers,” Manuscript under preparation for submission to J. Am. Ceram. Soc. (2020).

21.       A. Naik, Y. Zhou, A. Dey, D.L.G. Areallano, U. Okoroanyanwu, E.B. Secor, M.C. Hersam, J. Morse, J. Rothstein, K.R. Carter, J.J. Watkins, “Printed microfluidic sweat sensing platform for cortisol and glucose detection,” Manuscript under submission to J. Mat. Chem. C (2020).

20.       J. Park, X. Hu, M. Torfeh, U. Okoroanyanwu, A. Arbabi, J.J. Watkins, “Exceptional electromagnetic shielding efficiency of silver spray coated carbon fiber fabrics via roll-to-roll process,” J. Mat. Chem. C (2020).

19.       S. George, P. Nalleau, U. Okoroanyanwu, K. Dittmar, C. Holfeld, A. Wuest, “ Lithographic performance evaluation of a contaminated EUV mask after cleaning,” J. Vac. Sci. Technol. Bvol, 28(4), pp. 841-848 (2010)

18.       U. Okoroanyanwu, R. Kirsch, R. Wirtz, M. Grundkowski, W. Grundke, “Defect metrology in water immersion lithography,” Semiconductor Fabtechvol. 35, (November 2007)

17.       B. La Fontaine, Y. Deng, R. Kim, H.J. Levinson, U. Okoroanyanwu, R. Sandberg, T. Wallow, O. Wood, “Extreme ultraviolet lithography: From research to manufacturing,” J. Vac. Sci. Technol. B: Nanometer Structuresvol. 25(6), pp. 2089-2093 (2007)

16.        U. Okoroanyanwu, J. Kye, N. Yamamoto, K. Cummings, "Defectivity in water immersion lithography," Microlithography World, vol. 14(4), pp. 4-6 (2005)

15.       U. Okoroanyanwu, J.H. Lammers “Resist road to the 22 nm technology node” Future Fab Intl. vol. 17, pp. 68-71 (2004)

14.       K. Ronse, AM Goethals, R. Jonckheere, P. De Bisschop, U. Okoroanyanwu, Status and critical challenges for 157 nm lithography” Microelectronic Engineering, vol. 73-74, pp. 5-10 (2004).

13.       J.N. D’Amour, C.W. Frank, U. Okoroanyanwu, “Influence of substrate chemistry on the properties of ultra-thin polymer films, Microelectronic Engineering, vol. 73-74, pp. 209-217 (2004).

12.       U. Okoroanyanwu, “Materials and process issues delaying the Introduction of ArF lithography into production (part 1)” Future Fab International, vol. 12 (2002)

11.       U. Okoroanyanwu, “Materials and process issues delaying the introduction of ArF lithography into production (part 2)” Future Fab International, vol. 13 (2002)

10.       U. Okoroanyanwu, “Limits of ultra-thin resist processes” Future Fab Internationalvol. 10, pp. 157-163 (2001).

9.         U. Okoroanyanwu,“Thin film instabilities and implications for ultra-thin resist processes” J. Vac. Sci. TechnolB 18(6), 3381-3387 (2000).

8.         C. Pike, K.B. Nguyen, M.V. Plat, C.F. Lyons, P. King, K.A. Phan, U. Okoroanyanwu, H.J. Levinson, “Manufacturability of the ultrathin resist process” J. Vac. Sci. TechnolB 18(6), 3381-3387(2000).

7.         K.B. Nguyen, C. Lyons, J. Schefske, S. Bell, H.J.  Levinson, U. Okoroanyanwu, “Characterization of the manufacturability of ultra-thin resist” J. Vac. Sci. Technol. B 17(6), 3039 (1999)

6.         R. Brainard, C. Henderson, J. Cobb, V. Rao, J. Mackevich, U. Okoroanyanwu, S. Gunn, J. Chamber, S. Connolly, “Comparison of the lithographic properties of positive resists upon exposure to deep-and-extreme ultraviolet” J. Vac. Sci. Technol. B 17(6), pp. 3384-3389 (1999)

5.         U. Okoroanyanwu, T. Shimokawa, J.D. Byers, C.G. Willson, “Alicyclic polymers for 193 nm resist applications: synthesis and characterization” Chem. Materials10(11), 3319-3327 (1998).

4.         U. Okoroanyanwu, J.D. Byers, T. Shimokawa, C.G. Willson, “Alicyclic polymers for 193 nm resist applications: lithographic evaluation” Chem. Materials, 10(11), 3328-3333 (1998).

3.         U. Okoroanyanwu, T. Shimokawa, J.D. Byers, C.G. Willson, “Pd(II)-catalyzed addition and ring opening metathesis polymerization of alicyclic monomers: routes to new matrix resins for 193 nm photolithography” J. Mol. Catalysis A: Chemicalvol. 133, pp. 93-114 (1998).

2.         R.D. Allen, R. Sooriyakumaran, J. Opitz, G.M. Wallraff, G. Breyta, R.A. Dipietro, D.C. Hofer, R.R. Kunz, U. Okoroanyanwu, C.G. Willson,  “Progress in 193 nm positive resists” J. Photopolym. Sci. Technol.9(3), 465 (1996).

1.         H. Yang, V.V. Lissianski, U. Okoroanyanwu, W.C. Gardiner, Jr., K.S. Shin, “Reaction between CH3 and NO at combustion temperatures” J. Phys. Chem.97, 10042 (1993).


CONFERENCE AND SYMPOSIUM PROCEEDINGS ARTICLES

54.       U. Okoroanyanwu, N. Mehta, J. Park, S. Brandso, M. Lepine, J.D. Morse, J.J. Watkins, “Roll-to-Roll Fabrication of Conductive Copper Circuits Via Optical Lithography, Flexography and Electroless Plating,” 2018 Materials Research Society Meeting, Boston, MA (25-30 November 2018).

53.       U. Okoroanyanwu, J. Heumann, X. Zhu, C.H. Clifford, F. Jiang, P. Mangat, R. Ghaskadavi,  E. Mohn, R. Moses, O. Wood, H. Rolff, T. Schedel, R. Cantrell, P.Nesladek, N. LiCausi, X. Cai, W. Taylor, J. Schefske, M. Bender, N. Schmidt, “Towards the Optical Inspection Sensitivity Optimization of EUV Masks and EUVL-Exposed Wafers” Proc. of SPIE vol. 8352 83520V-1 - 83520V-14 (2012)

52.       O. Montal, I.  Dolev, M. Rozentsvige, A. Conley, M.-P. Cai, K. Dotan, C. Ngai, Bencher, T. Wallow, O. Wood, U. Okoroanyanwu, “EUV defect characterization on post litho and etch for 1x and 2x node processes” Proc. SPIEvol. 7971(2011)

51.       V.K Daga, Y Lin; J.J Watkins, U. Okoroanyanwu, K. Petrillo, D. Ashworth, H.-G. Peng, C.L. Soles, “Additive loaded EUV photoresists: performance enhancement and the underlying physics” Proc. SPIEvol. 7969 (2011)

50.       E. Gallagher, L. Kindt, J. Whang, M. Barrett, O. Wood, U. Okoroanyanwu, H. Kato, T. Wallow, “A lifetime study of EUV masks,” Proc. SPIE, Photomask Technologyvol. 7823 (2010)

49.       U. Okoroanyanwu, O. Wood, B. LaFontaine, P. Ackmann, A. Tchikoulaeva, K. Bubke, C. Holfeld, J.-H. Peters, S. Kini, S. Watson, I. Lee, M. Bu, P. Lim, S. Raghunathan, C. Boye, “Assessing EUV mask defectivity,” Extreme Ultraviolet LithographyProc. SPIEvol. 7636, p. 76360J (2010).

48.       U. Okoroanyanwu, A. Jiang, K. Dittmar, T. Fahr, T. Laursen, O. Wood, K. Cummings, C. Holfeld, J.-H. Peters, E. Gullikson,B. La Fontaine, “Monitoring reticle molecular contamination in ASML EUV Alpha Demo Tool,” Extreme Ultraviolet Lithography, Proc. SPIEvol. 7636, p. 76360H (2010).

47.       U. Okoroanyanwu, K. Dittmar, T. Fahr, T. Wallow, B. LaFontaine, O. Wood, C. Holfeld, K. Bubke, J.-H. Peters, A. Jiang, “Analysis and characterization of contamination in EUV Reticles,” Extreme Ultraviolet Lithography, Proc. SPIEvol. 7636, p. 76361Y (2010).

46.       O. R. Wood II, C,-S. Koay, K.E. Petrillo, H. Mizuno, S. Raghunathan, J. C. Arnold, D.V. Horak, M. Burkhardt, G. McIntyre, Y. Deng, Bruno M. La Fontaine, U. Okoroanyanwu, A. Tchikoulaeva, T.I. Wallow, J.H. C. Chen, M. E. Colburn, S. S. C. Fan, B.S. Haran, Y. Yin, C. Holfeld, K. Bubke, J. Techel, J.-H. Peters, “EUV lithography at the 22-nm technology node,” Extreme Ultraviolet Lithography, Proc. SPIEvol. 7636, p. 76361M (2010).

45.       A. Tchikoulaeva, U. Okoroanyanwu, O. Wood, B. La Fontaine, C. Holfeld, S. Kini, M. Pelkert, C. Boye, C.-S. Koay, K. Petrillo, H. Mizuno, “EUV reticle defectivity evaluation,” Alternative Lithographic TechnologiesProc. SPIEvol. 7271, pp. 727117-1 - 727117-8  (2009)

44.       O. Wood, C.-S. Koay, K. Petrillo, H. Mizuno, s. Raghunathan, J. Arnold, d. Horak, M. Burkhardt, G. McIntyre, Y. Deng, B. La Fontaine, U. Okoroanyanwu, A. Tchikoulaeva, T. Wallow, J.H.-C. Chen, M. Colburn, S.S.-C. Fan, B.S. Haran, Y. Yin, “Integration of EUV lithography in the fabrication of 22-nm devices,” Alternative Lithographic TechnologiesProc. SPIEvol. 7271, pp. 727104-1 -11 (2009)

43.       K.D. Cummings, T. Laursen, B. Pierson, S.-I. Han, R. Watso, Y.V. Dommelen, B. Lee, Y. Deng, B. La Fontaine, T. Wallow, U. Okoroanyanwu, O. Wood, A. Tchikoulaeva, C. Holfeld, J.H. Peters, C.-S. Koay, K. Petrillo, T. Dibiase, S. Kini, H. Mizuno, “An investigation of EUV lithography defectivity,” Photomask TechnologyProc. SPIEvol. 7122, 7122G (2009)

42.       B. La Fontaine, A. Tchikoulaeva, U. Okoroanyanwu, O. Wood, P. Ackman, C. Holfeld, K. Bubke, J.-H. Peters, S. Kini, S. Raghunathan, C. Boye, M. Yokoyama, Y. Ikuta, M. Komakine, “Assessing EUV Mask Defectivity,” Proc. International Symposium on Extreme Ultraviolet Lithography (2009)  

41.       U. Okoroanyanwu, E. Langer, A. Fumar-Pici, T. Wallow, O. Wood, B. La Fontaine, C. Holfeld, J.-H. Peters, M. Bender, M. Rossinger, S. Trogisch, F. Goodwin, A. Wuest, S. Huh, G. Denbeaux, Y. Fan, A. Antohe. L. Yankulin, R. Garg, K. Goldberg, P. Nalleau, “EUV reticle contamination and cleaning,” Proc. International Symposium on Extreme Ultraviolet Lithography(2008)

40.       R. Kirsch, A. Martin, U. Okoroanyanwu, W. Grundke, U. Vogler, M. Beyer, E. Valfer, S. Weiher-Tellford, R. Perlovitch, N. Racah, P. Vanoppen, R. Moreman, “Production aspects of 45nm immersion lithography defect monitoring using laser DUV inspection methodology,” Metrology, Inspection and Process Control for Microlithography XXIIProc. SPIEvol. 6922, 692204 (2008)

39.       B. La Fontaine, Y. Deng, R.-H. Kim, H.J. Levinson, S. McGowan, U. Okoroanyanwu, R. Seltmann, C. Tabery, A. Tchikoulaeva, T. Wallow, O. Wood, J. Arnold, D. Canaperi, M. Colburn, K. Kimmel, C.-S. Koay, E. McClellan, D. Medeiros, S.P. Rao, K. Petrillo, Y. Yin, H. Mizuno, S. Bouten, M. Crouse, A.V. Dijk, Y.V. Dommelen, J. Galloway, S.-. Han, B. Kessels, B. Lee, S. Lok, B. Niekrewicz, B. Pierson, R. Routh, E. Schmit-Weaver, K. Cummings, J. Word, “The use of EUV lithography to produce demonstration devices,” Emerging Lithographic Technologies XIIProc. SPIEvol. 6921, 69210P (2008)

38.       O.R. Wood III, D. Back, R. Brainard, G. Denbeaux, D. Goldfarb, F. Goodwin, J. Hartley, K. Kimmel, C. Koay, B. La Fontaine, J. Mackey, B. Martinick, W. Montgomery, P. Nalleau, U. Okoroanyanwu, K. Petrillo, B. Pierson, M. Tittnich, S. Trogisch, T. Wallow, Y. Wei, “Initial experience establishing an EUV baseline lithography process for manufacturability assessment,” Emerging Lithographic Technologies XI, Proc. SPIEvol. 6517, 65170U (2007)

37.       Y. Wei, K. Petrillo, S. Brandl, F. Goodwin, P. Benson, U. Okoroanyanwu,            “Selection and evaluation of developer-soluble topcoat for 193 nm immersion lithography,“ Advances in Resist Technology and Processing XXIIIProc. SPIEvol. 6153, 615306 (2006)

36.       T. Wallow, B. La Fontaine, R. Sandberg, R.-H., Kim, U. Okoroanyanwu, R. Nassar, K. Spear-Alfonso, J. Thackeray, “Improved EUV resist performance through processing refinements,” Proc. International Symposium on Extreme Ultraviolet Lithography (2006)

35.       P. Zhang,  S.J. Weigel, T. Braymer, T. Markley, B. Ross, M. Jaramillo, S. Cassel, O. Kritsun, U. Okoroanyanwu, “Novel depolymerizable topcoats for immersion lithography” Proc. SPIEvol. 6153 (2006)

34.       M. Tittnich, J. Hartley, G. Denbeaux, U. Okoroanyanwu, H. Levinson, K. Petrillo, C. Robinson, D. Gil, D. Corliss, D. Back, S. Brandl, C. Schwarz, F. Goodwin, Y. Wei, B. Matinick, r. Housley, P. Bensen, K. Cummings, “A year in the life of an immersion lithography alpha tool at Albany NanoTech,” Emerging Lithographic Technologies X,Proc. SPIEvol. 6151, 615101 (2005)

33.       U. Okoroanyanwu, J.Kye, N. Yamamoto, H.J. Levinson, K. Cummings, "Prospects & challenges of defectivity in water immersion lithography," Proc. 2nd Symposium on Immersion Lithography, Brugge, Belgium, Sept. 2005

32.       U. Okoroanyanwu, N. Stepanenko, B. Vereecke, A. Eliat, M. Kocsis, Y.S. Kang, R. Jonkheere, T. Conard, K. Ronse, “Experimental investigation of fabrication process-, transportation-, storage-, and handling-induced contamination of 157nm reticles and vacuum-UV cleaning” Optical Microlithography XVII, Proc. SPIE vol. 5377, pp. 487-503 (2004).

31.       U. Okoroanyanwu, R. Gronheid, J. Coenen, J. Hermans, K. G. Ronse, “Contamination monitoring and control on ASML MS-VII 157-nm exposure tool” Optical Microlithography XVII, Proc. SPIE vol. 5377, pp.1695-1707 (2004).

30.       G. Wells, J. Hermans, R. Watso, Y.S. Kang, R. Morton, M. Kocsis, U. Okoroanyanwu, P. DeBisschop, N. Stepanenko, K. G. Ronse “Optical path and image performance monitoring of a full-field 157nm scanner” Optical Microlithography XVII, Proc. SPIE, vol. 5377, pp. 91-98 (2004).

29.       K. Ronse, A.M. Goethals, R. Jonckheere, P. De Bisschop, U. Okoroanyanwu, “Update on critical challenges for 157nm lithography” Proc. 20th European Mask Conference on mask technology for integrated circuits and micro-components43, 15 (2004)

28.       J.N. D’Amour, C.W. Frank, U. Okoroanyanwu, “Influence of substrate chemistry on the properties of ultra-thin polymer films, American Inst. Chem. Engineers Journal (2003)

27.       J.N. D’Amour, C.W. Frank, U. Okoroanyanwu, “Modifications to thermophysical behavior in ultrathin polymer films” Advances in Resist Technology & Processing XX, Proc. SPIE 5039, pp.996-1007 (2003).

26.       J.L. Cobb, P.M. Dentinger, M. Paul, L.L. Hunter, D.J. O’Connel, G. M. Gallatin, W.D. Hinsberg, F.A. Houle, M.I. Sanchez, W.-D. Domke, S. Wurm, U. Okoroanyanwu, S.H. Lee, “EUV photoresist performance results from the VNL and the EUV LLC” Emerging Lithographic Technologies VIProc. SPIEvol. 4688 (2002)

25.       J.N. D’Amour, C.W. Frank, U. Okoroanyanwu, “Measuring thermophysical properties of ultrathin photoresist films” Advances in Resist Technology & Processing XIX, Proc. SPIE4690, pp. 936-942, 2002.

24.       U. Okoroanyanwu, P. Kunze, K.Al-Shamery, J. Romero, J. Bernard, “Impact of photo-induced species in O2-containing gases on lithographic patterning at 193nm wavelength” Optical Microlithography XV, Proc. SPIE 4691, 746 (2002)

23.       J. L. P. Jessop, S. N. Goldie, A. B. Scranton, G. J. Blanchard, B. Rangarajan, U. Okoroanyanwu, R. Subramanian and M. K. Templeton, “Spectroscopic characterization of acid mobility in chemically amplified resists” Advances in Resist Technology and Processing XVII3999, 161-170 (2000).

22.       U. Okoroanyanwu, H.J. Levinson, C.-Y. Yang, S.K. Pangrle, J. Schefske,  E. Kent,  “Integration considerations for 130-nm device patterning using ArF lithography” Optical Microlithography XIII, Proc. SPIE. 4000, 423 (2000).

21.       U. Okoroanyanwu, C. Pike,  H.J. Levinson,  “Process-induced defects in sub-150-nm device patterning using 193-nm lithography” Metrology, Inspection, and Process Control for  Microlithography XIV, Proc. SPIE 3998, 277 (2000).

20.       U. Okoroanyanwu, H.J. Levinson, B. Singh, Yedur, J., Romero, S. Lee, “Impact of optical absorption on process control for sub-150-nm device patterning using 193-nm lithography” Metrology, Inspection, and Process Control for Microlithography XIV, Proc. SPIE, 3998781 (2000).

19.       J. Schefske, E. Kent, U. Okoroanyanwu, H.J. Levinson, C.R. Masud, “Issues and non-Issues on a 193-nm step-and-scan system in production” Optical Microlithography XIII, Proc. SPIE4000, 460 (2000).

18.       K.A. Phan, C.A. Spence, J. Schefske, U. Okoroanyanwu, H.J.  Levinson, “Defect printability comparison between 193-nm and 248-nm lithography processes using simulation and wafer SEM images” Metrology, Inspection, and Process Control for Microlithography XIV, Proc. SPIE 3998, 773 (2000)

17.       U. Okoroanyanwu, J. Cobb, P. Dentinger, P, C. Henderson, V. Rao, C. Pike “Defects and metrology of ultrathin resist films” Metrology, Inspection, and Process Control for  Microlithography XIV, Proc. SPIE 3998, 515 (2000).

16.       C. Pike, K.B. Nguyen, M.V. Plat, C.F. Lyons, P. King, K.A. Phan, U. Okoroanyanwu, H.J. Levinson, “Manufacturability of the ultrathin resist process” Emerging Lithographic Technologies III, Proc. SPIE (2000)

15.       V. Rao, J. Cobb, C. Henderson, U. Okoroanyanwu, D. Bozman, M. Pawitter, M.; R. Brainard, J. Machevich “Ultrathin photoresists for EUV lithography” Emerging Lithographic Technologies III, Proc. SPIE, vol 3676, pp. 615-626 (1999)

14.       C.R. Kessel, L.D. Boardman, S.J. Rhyner, J.L. Cobb, C.C. Henderson, V. Rao, U. Okoroanyanwu, “Novel silicon-containing resists for EUV and 193 nm lithography” Adv. in Resist Technology and Processing, Proc. SPIEvol. 3678, pp. 214-220 (1999).

13.       U. Okoroanyanwu, H.J. Levinson, A.M. Goethals, F. Van Roey, “Progress in 193-nm photoresists and related process technologies” OMM Interface’98 Proceedings, 1 (1998)

12.       U. Okoroanyanwu, H.J.  Levinson, A.M. Goethals, F. Van Roey,  “Lithographic process studies of 193 nm photoresists from six major commercial suppliers”  Proc. 4th  Int. Conf. On 193 nm Lithography, Telfts, Tyrol, Austria, 14-17 September, P-001 (1998)

11.       K. Patterson, U. Okoroanyanwu, T. Shimokawa, J.D. Byers, S. Cho, C.G. Willson, “Improving performance of 193 nm photoresists based on alicyclic polymers” Proc. SPIE3333, 425 (1998)

10.       U. Okoroanyanwu, J.D. Byers, T. Cao, S.E. Webber, C.G. Willson, “Monitoring photoacid generation in chemically amplified resist systems” Proc. SPIE. 3333, pp.747-757 (1998).

9.         U. Okoroanyanwu, J.D. Byers, T. Shimokawa, S.E. Webber, C.G. Willson,  “Deprotection kinetics of new 193 nm resists derived from alicyclic polymers” Proc. Am. Chem. Soc. Div. Polym. Mater.: Sci. and Eng., vol. 77, pp. 469-470 (1997)

8.         U. Okoroanyanwu, J.D. Byers, T. Shimokawa, K. Patterson, C.G. Willson,  “Alicyclic polymers for 193 nm lithography” Proc. 11th International Conference on Photopolymers, SPE, Mid-Hudson Section of SPE, McAfee, New Jersey, USA, 1 (1977).

7.         U. Okoroanyanwu, T. Shimokawa, D. Medeiros, C.G. Willson, J.M.J. Frechet, Q.J.  Niu, J.D. Byers, R.D. Allen, “New single layer photoresists for 193-nm photolithography” Proc. SPIE, 304992 (1997) 

6.         Q.J. Niu, J.M.J. Frechet, U. Okoroanyanwu, J.D. Byers, C.G. Willson, “Novel functional polymers and copolymers for 193 nm and 248 nm chemically amplified resists” Proc. SPIE 3049, pp.113-125 (1997).

5.         R.D. Allen, R. Sooriyakumaran, J. Opitz, G.M. Wallraff, R.A. Dipietro, G. Breyta, D.C. Hofer, R.R. Kunz, S. Jayraman, R. Schick, B. Goodall, U. Okoroanyanwu,  C.G. Willson, “Protecting groups for 193 nm photoresists”   Proc. SPIE 2724, 334 (1996).

4.         C.G. Willson, U. Okoroanyanwu, T. Shimokawa, D.  Medeiros, J.M.J. Frechet, A.J. Niu,  J.D. Byers, R.D. Allen,  “New polymers for 193-nm lithography”  Proc. 2nd  Int. Conf. On 193 nm Lithography, Colorado Springs, Colorado, USA, July (1996).

3.         V.V. Lissianski, H. Yang, U. Okoroanyanwu, W.C. Gardiner, Jr., K.S. Shin,  “Shock tube study of the reaction of methyl radicals with oxygen” Proc. Third International Conference on Chemical Kinetics, Gaithersburg, Maryland, USA, 96 (1993).

2.         W.C. Gardiner, Jr. V.V. Lissianski, U. Okoroanyanwu, K.S. Shin, H. Yang, M. Zhao, “Chemistry of NOx reaction in high temperature gas mixtures containing hydrocarbon radical” Proceedings of the Second International Conference on Combustion Technologies for a Clean Environment, Lisbon, Portugal, 16 (1993).

1.         V.V. Lissianski, H. Yang, U. Okoroanyanwu, W.C. Gardiner, Jr., K.S. Shin,  “Shock tube study of the reaction of methyl radicals with nitric oxide” Proceedings of the Technical Meeting of the Combustion Institute, The Eastern States Section, 117 October (1993).